Defense Production Act (DPA) Title III Technology Market Research for 3D Microelectronics for Information Protection Project

Funding Opportunity Number: RFI-AFRL-RQKM-2016-0011
Opportunity Category: Discretionary
Funding Instrument Type: Cooperative Agreement
Category of Funding Activity: Science and Technology and other Research and Development
CFDA Number: 12.800
Eligible Applicants Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Agency Name: DOD-AFRL
Closing Date: Feb 05, 2016
Award Ceiling:
Expected Number of Awards: 1
Creation Date: Jan 06, 2016
Funding Opportunity Description: The Title III program has identified 3D High Density Microelectronics for Information Protection as a technology area of interest for its future activities, and interested firms are encouraged to determine if they have information pertaining to this topic. For the purpose of this RFI, the Government is defining 3D High Density Microelectronics for Information Protection as three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD and commercial supplier of 3D microelectronics modules incorporating Information Protection. Note: The program funding above ($100,000) is an estimate only and does not reflect any potential program funding which will be determined at a later date.



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