Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program

Funding Opportunity ID: 284673
Opportunity Number: FOA-AFRL-RQKM-2016-0017
Opportunity Title: Defense Production Act (DPA) Title III 3D Microelectronics for Information Protection Program
Opportunity Category: Discretionary
Opportunity Category Explanation:
Funding Instrument Type: Cooperative Agreement
Category of Funding Activity: Science and Technology and other Research and Development
Category Explanation:
CFDA Number(s): 12.800
Eligible Applicants: Unrestricted (i.e., open to any type of entity above), subject to any clarification in text field entitled “Additional Information on Eligibility”
Additional Information on Eligibility:
Agency Code: DOD-AFRL
Agency Name: Department of Defense
Air Force — Research Lab
Posted Date: Jun 15, 2016
Close Date: Aug 01, 2016
Last Updated Date: Jun 15, 2016
Award Ceiling:
Award Floor:
Estimated Total Program Funding: $13,200,000
Expected Number of Awards: 1
Description: The objective of this DPA Title III Project is to expand existing domestic supplier production capabilities to produce three-dimensional (3D), ultra-high density microelectronics modules for use in Critical Program Information (CPI) protection applications. The focus of this effort shall be on product yield improvement and the expansion of production facilities to create an economically viable DoD supplier of 3D microelectronics modules incorporating Information Protection. The quality of ultra-high density modules produced throughout this effort will be verified against current industry standards; quality verification efforts will include production and testing of the 3D ultra-high density microelectronics modules.
Version: Synopsis 1



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